Appeal No. 2002-0981
Application 09/005,895
Claims 1 and 25 are illustrative:
1. A method of forming a thermally curable material on a
support structure in an electronic device, the method comprising:
placing the electronic device support structure on a
heatable structure in a process chamber;
depositing through a screen to form thermally curable
material including a conductive adhesive on a surface of the
support structure while it is in the process chamber; and
heating the heatable surface to heat the support structure
to a temperature sufficient to cure the deposited material while
the support structure is still in the process chamber to bond the
thermally curable material to the support structure.
25. A screen-printing system, comprising:
a heatable surface adapted to hold a support structure of an
electronic device; and
a screen through which a thermally curable material
including a conductive adhesive can be deposited onto portions of
the support structure while the support structure is placed on
the heatable surface;
the system adapted to heat the heatable surface to cure
thermally curable material that may be deposited on the support
structure.
THE REFERENCES
Dery et al. (Dery) 4,659,872 Apr. 21, 1987
Pennisi et al. (Pennisi) 5,128,746 Jul. 7, 1992
Zhou et al. (Zhou) 5,985,043 Nov. 16, 1999
(filed Jul. 21, 1997)
MacKay et al. (MacKay) 5,988,487 Nov. 23, 1999
(filed May 27, 1997)
Wood et al. (Wood) 6,107,122 Aug. 22, 2000
(filed Aug. 4, 1997)
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 Next
Last modified: November 3, 2007