Appeal No. 2002-0981
Application 09/005,895
substituted by a thermally curable adhesive material
(Zhou) and conductive adhesive (Wood). [answer, page 8]
For a prima facie case of obviousness to be established, the
applied prior art must be such that it would have provided one of
ordinary skill in the art with both a motivation to carry out the
claimed invention and a reasonable expectation of success in
doing so. See In re Vaeck, 947 F.2d 488, 493, 20 USPQ2d 1438,
1442 (Fed. Cir. 1991); In re O’Farrell, 853 F.2d 894, 902, 7
USPQ2d 1673, 1680 (Fed. Cir. 1988).
MacKay teaches that “with the stencil and plate remaining in
place on top of the substrate, the substrate is heated to a
temperature sufficient to reflow the solder paste material. In
this manner, the solder paste is pulled away (i.e., detached)
from the stencil side walls and anchored to the substrate pad
before the stencil is removed” (col. 2, lines 34-39). Zhou,
however, teaches that during reflow the fluxing agent, which acts
as an adhesive, “crosslinks to mechanically bond and encapsulate
the surfaces and their metallizations” (col. 2, lines 63-65),
“hardens quickly and soon after the solder bump melts” (col. 11,
line 61), and “forms strong adhesion of the cured composition to
the chip, substrate and solder joints” (col. 11, lines 66-67).
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