Appeal No. 2002-0981
Application 09/005,895
Claim 25
MacKay discloses a screen-printing system (col. 4, lines 48-
52) comprising a heatable surface (20) adapted to hold a support
structure (5) of an electronic device (col. 3, lines 54-63), a
screen (40) through which thermally curable material (70) can be
deposited onto portions of the support structure while the
support structure is placed on the heating surface (col. 4,
lines 23-64), and a system adapted to heat the heatable surface
to cure the thermally curable material on the support structure
(col. 5, lines 4-10).
MacKay does not disclose a thermally curable material
including a conductive adhesive. The system claimed in the
appellant’s claim 25, however, does not include such a thermally
curable material. The claim merely requires that the system is
capable of screening and curing a thermally curable material
including a conductive adhesive. Because Wood’s conductive
adhesive (col. 7, lines 25-27), like MacKay’s solder (col. 3,
lines 59-60), can form bumps on bond pads, it reasonably appears
that MacKay’s system is capable of screening solder containing at
least a trace amount of conductive adhesive.4 Also, because
4 The appellant’s claim 25 does not specify the amount of
conductive adhesive in the thermally curable material.
8
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