Ex Parte BLAZIERT et al - Page 4




            Appeal No. 2002-2134                                                          Page 4              
            Application No. 09/250,481                                                                        


            anticipates a claim must focus on what subject matter is encompassed by the claim and             
            what subject matter is described by the reference.  As set forth by the court in Kalman           
            v. Kimberly-Clark Corp., 713 F.2d 760, 772, 218 USPQ 781, 789 (Fed. Cir. 1983), cert.             
            denied, 465 U.S. 1026 (1984), it is only necessary for the claims to "'read on' something         
            disclosed in the reference, i.e., all limitations of the claim are found in the reference, or     
            'fully met' by it."                                                                               


                   Claims 1 and 19, the independent claims on appeal, read as follows:                        
                   1.    A method of forming a circuit board with electronic assemblies lying in              
                   different planes, comprising:                                                              
                         providing said circuit board with said electronic assemblies and a                   
                   connecting lead thereon;                                                                   
                         forming a channel in a surface of said circuit board opposite said                   
                   connecting lead, said channel dividing said circuit board into a first portion and a       
                   second portion; and                                                                        
                         bending said circuit board at said channel so that said second portion is at         
                   an angle of between 0 and 180 degrees relative to said first portion.                      
                   19.   A method of forming a circuit board with electronic assemblies lying in              
                   different planes, comprising:                                                              
                         providing said circuit board with said electronic assemblies thereon, at             
                   least one channel of a predetermined depth in a first surface of said circuit              
                   board, and a connecting lead on a second surface of said circuit board opposite            
                   said at least one channel, said at least one channel dividing said circuit board           
                   into first and second portions, said connecting lead electrically interconnecting a        
                   first of said electronic assemblies on said first portion with a second of said            
                   electronic assemblies on said second portion; and                                          
                         bending said circuit board at said at least one channel between said first           
                   and second portions of the circuit board so that said first portion is displaced           
                   between 0 and 180 degrees from said second portion.                                        








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