Appeal No. 2002-2134 Page 5
Application No. 09/250,481
Wang's invention provides a means for interconnecting two or more electrical
components having different planes of orientation. Figure 1 shows a perspective view
of two multi-chip modules 10 that are electrically connected to each other by a three
dimensional thin-film electrical interconnector 12 constructed according to principles of
Wang's invention. The multi-chip modules (MCM) may each comprise a number of
integrated circuits or the like that each require electrical connection with a printed circuit
board or other MCM. For purposes of reference, the surface of the MCM located at the
top portion of Figures 1 and 2 will be referred to as the front side and the surface of the
thin-film interconnector adjacent to the MCM front side will be referred to as the front
side throughout this description. The surface opposite the front side of the thin-film
interconnector will be referred to as the back side throughout this description.
Wang's thin-film interconnector 12 comprises two connectors 14 that are
connected to each other by a plurality of electrically conductive wires 16 extending
outwardly and away from adjacent faces of each connector. The wires are made from
electrically conductive materials and facilitate the transfer of electrical signals and/or
power between the connectors 14.
Wang teaches (column 3, line 21, to column 4, line 18)
a method for fabricating a three dimensional thin-film interconnector that permits
electrical connection between two or more electrical components that are
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: November 3, 2007