Appeal No. 2002-2134 Page 6
Application No. 09/250,481
positioned at different planes of orientation and have a high density of electrical
connections. The thin-film interconnector is manufactured by depositing a
dielectric layer onto the surface of a substrate. A electrically conductive signal
plane is deposited onto the surface of the dielectric layer at selected locations
that are electrically isolated from each other. A second dielectric layer similar to
the preceding dielectric layer is deposited onto the surface of both the signal
plane and the portions of the preceding dielectric layer residing between the
deposited portions of the signal plane.
A plurality of through holes are formed in the second dielectric layer that
extend from the surface of the dielectric layer to the preceding signal plane. The
number and arrangement of the through holes are determined according to the
electrical connection requirements of the particular electrical components. The
through holes are filled with electrically conductive material to form vias. The
sequence of depositing a dielectric layer, selectively depositing signal planes,
forming a plurality of through holes, and filling the plurality of through holes may
be repeated until a predetermined arrangement of signal planes and vias are
obtained.
Each signal plane is deposited onto a selected portion of the preceding
dielectric layer. The interdigitated sequence of signal planes and dielectric layers
in each selected portion make up a signal plane set. The thin-film interconnector
comprises at least two connectors that each comprise a signal plane set. If
desired, a ground plane may be substituted for a signal plane during the above
mentioned sequence. The ground plane comprises an electrically conductive
material that serves to minimize any unwanted electromagnetic effects that may
otherwise be caused by signal planes in close proximity to one another.
However, unlike a signal plane, the ground plane does not require electrical
connection with a via.
After the predetermined arrangement of signal planes and vias are
obtained, a plurality of contact pads are deposited onto the surface of a final
dielectric layer forming the front side surface. The contact pads are deposited at
locations corresponding to a plurality of vias in the uppermost signal plane set.
Each contact pad is electrically connected to a via which is electrically connected
with a signal plane. A plurality of wires are selectively deposited onto the surface
of the final dielectric layer. The wires are deposited so that each wire forms an
electrical connection between contact pads that are electrically connected to a
signal plane set of one connector and the corresponding contact pads that are
electrically connected to a signal plane set of another connector.
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