Ex Parte GORUGANTHU et al - Page 9




                 Appeal No. 2003-0123                                                                               
                 Application No. 09/383,781                                                                         
                 second illumination.  (Col. 4, ll. 23-26).  While the invention of Tanaka might be                 
                 used on the back side of a semiconductor device, the Examiner has not provided                     
                 motivation for such a modification.  Neither Tanaka nor Takemura disclose the                      
                 desirability of providing an image path to the underlying  circuit side.  Moreover,                
                 there is no indication that the two step illumination of Tanaka would provide the                  
                 insulation property described by Takemura.  The mere fact that the prior art could be              
                 modified would not have made the modification obvious unless the prior art                         
                 suggested the desirability of the modification.  In re Gordon, 733 F.2d 900, 902,                  
                 221 USPQ 1125, 1127 (Fed. Cir. 1984); In re Laskowski, 871 F.2d 115, 117, 10                       
                 USPQ2d 1397, 1398 (Fed. Cir. 1989).  The record indicates that the motivation                      
                 relied upon by the Examiner suggesting the combination of Tanaka and Takemura                      
                 came from the Appellants’ description of the invention in the specification rather                 
                 than from the applied prior art and that, therefore, the Examiner used impermissible               
                 hindsight in rejecting the claims.  See W.L. Gore & Associates v. Garlock, Inc., 721               
                 F.2d 1540, 1553, 220 USPQ 303, 312-13 (Fed. Cir. 1983); In re Rothermel, 276                       
                 F.2d 393, 396, 125 USPQ 328, 331 (CCPA 1960).                                                      
                        The subject matter of claim 9 requires laser-chemical etching the back side of              
                 the semiconductor device using two different power levels and using light to capture               
                 an image of the circuit through the back side of the semiconductor device.  As stated              



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