The opinion in support of the decision being entered
today was not written for publication in a law journal
and is not binding precedent of the Board.
Paper No. 19
UNITED STATES PATENT AND TRADEMARK OFFICE
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
Ex parte KAZUHIKO YAMAMOTO and YUZO AKADA
Appeal No. 2003-0385
Application No. 09/348,344
ON BRIEF
Before KIMLIN, LIEBERMAN and DELMENDO, Administrative Patent
Judges.
KIMLIN, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claim 1.
Claims 5-8 have been allowed by the examiner. Claim 1 is
reproduced below:
1. A hot-melt sheet for holding and protecting
semiconductor wafers during processing, the sheet comprising
a hot-melt layer A having a melting point of 105°C or lower;
a pressure-sensitive adhesive layer B formed on one surface
of said hot-melt layer A; and
-1-
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