Appeal No. 2003-0385
Application No. 09/348,344
a reinforcing layer C having a melting point higher by 20°C
or more than that of said hot-melt layer A, said reinforcing
layer C being formed on a surface of said hot-melt layer A
opposite the surface having formed thereon the adhesive layer B.
The examiner relies upon the following reference as evidence
of obviousness:
Ishiwata et al. 4,999,242 Mar. 12, 1991
(Ishiwata)
Appellants' claimed invention is directed to a hot-melt
sheet comprising a hot-melt layer A, a pressure-sensitive
adhesive layer B on one surface of layer A, and a reinforcing
layer C formed on layer A "opposite the surface having formed
thereon the adhesive layer B." In other words, hot-melt layer A
has adhesive layer B on one surface and reinforcing layer C on
the opposite surface. The reinforcing layer C has a melting
point that is 20°C or more than the melting point of the hot-melt
layer A. Appellants' specification, at page 8, discloses
ethylene/vinyl acetate copolymer (EVA) as a suitable
thermoplastic material for the hot-melt layer A, and at page 13
teaches polyethylene as an exemplary reinforcing layer C.
Appealed claim 1 stands rejected under 35 U.S.C. § 103 as
being unpatentable over Ishiwata.
We have thoroughly reviewed each of appellants' arguments
for patentability. However, we are in complete agreement with
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