Appeal No. 2003-0623
Application No. 09/348,632
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(August 1994).
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Andricacos (Andricacos (II)), “Copper On-Chip Interconnections: A Breakthrough in
Electrodeposition to Make Better Chips,” Interface, The Electrochemical Society, Inc., Vol. 8, No.
1, pp. 32-37 (Spring 1999).
Bulkeley (Bulkeley (I)), “The first copper-based ICS debut,” Design News Semiconductors,
pp. S11-S14 (June 7, 1999).
Alterio, “IBM Deal Features New Chip: Power4 Will Drive a New German Supercomputer,”
The Journal News, (Unknown Publication Date).
Bulkeley (Bulkeley (II)), “IBM, Sony Set Game Plan for PlayStation 3 Chips,” ZDNet News
(Unknown Publication Date).
The appealed claims stand rejected as follows:
1) Claim 116 under 35 U.S.C. § 112, second paragraph, as being indefinite for failing to
particularly point out and distinctly claim the subject matter which applicant regards
as the invention;
2) Claim 116 under 35 U.S.C. § 112, first paragraph, as lacking written descriptive
support for the subject matter presently claimed;
3) Claims 1 through 6, 8, 9, 11, 110, 111, 113 through 115, and 117 through 123 under
35 U.S.C. § 102(b) as anticipated by Chang alone or Chang as interpreted in view of
Poris and Silman;
3
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