Appeal No. 2003-1300
Application No. 09/643,372
application.2
The subject matter on appeal relates to a method for
fabricating a dual-diameter electrical conductor for use in a
microelectronic structure, wherein a neck portion of the
conductor is fabricated with a diameter smaller than a
lithographically defined diameter of a body portion.
(Specification, pages 1-9.) According to the appellants (id. at
page 1), “[t]he use of this dual-diameter plug geometry provides
a misalignment tolerance wherein the body portion of the plug is
protected from exposure to subsequently deposited materials and
process ambients when only the neck portion of the plug is
completely overlapped by a subsequentially [sic] deposited
conductor.” Further details of this appealed subject matter are
recited in representative claim 37 and 44, the only independent
claims on appeal, reproduced below:
37. A method for fabricating a dual-diameter
electrical conductor comprising the steps of:
providing a substrate having a first conductive
region formed of a first conductive material,
depositing a layer of a first dielectric material
on said substrate,
2 In reply to the final Office action mailed Apr. 26, 2002
(paper 8), the appellants submitted an amendment pursuant to 37
CFR § 1.116 (2001) on Jun. 26, 2002 (paper 9), proposing
change(s) to claim 44. The examiner indicated that this
amendment will be entered for purposes of this appeal.
(Advisory action mailed Jul. 29, 2002 (paper 10).
2
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