Interference No. 105,113
top schematic view of such an apparatus, which is described at column 4, line 35 to column 5,
line 6:
The electroplating system platform 200, which is enclosed in a clean environment using panels
such as plexiglass panels, generally comprises a loading station 210, a thermal anneal chamber
211, a spin-rinse-dry (SRD) station 212, and a mainframe 214 including a mainframe transfer
station 216 and a pair of processing stations 218. Two loading station transfer robots 228
provide access to wafers in (a) two wafer cassette receiving areas 224 in loading station 210,
(b) a wafer orientor 230 in loading station 210, (c) two thermal anneal chambers 211, and (d) two
SRD modules 238 in SRD station 212. Robots (unnumbered) in main frame transfer station 216
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Last modified: November 3, 2007