Appeal No. 2004-0633
Application No. 10/011,198
Figure 5. The conductive structures 120, 122 can be made of the
same metal, and result from the same metal deposition step,
indicated by the “M1” designation, shown in Figure 5. The
deposition process continues at least until the trenches are
filled. Any metal deposited onto the top of insulation 26 can
be removed through etching or by way of planarization
techniques. The resulting conductive structures 120, 122 serve
as interconnects or other conductive lines or paths. In
addition, the conductive structures 120, 122 also provide
conductive material for plugs that may be desired anywhere along
those paths. Further, because such plugs will be defined along
with the interconnects, the result will be a continuous and
homogeneous electrically conductive structure including one part
extending from one surface 24 to a more elevated surface 132,
where other interconnects could be formed. See paragraph [0026]
at the top of page 9 of the specification. Hence, it is clear
that M1 shown in Figure 5 is the continuous and homogeneous
electrically conductive structure, which includes interconnect
site 124 and plug 128.
Also, in paragraph [0037], at the bottom of page 13 of
appellants’ specification, the specification describes Figure
18. Here, the recessed areas of openings 510 are filled with
oxide 526. Oxide 526 can be etched back, as can the BPSG 508 in
order to better expose the “plugs” included as an integral part
of the conductive material 522 in openings 512, 514, and 516.
Here again, is an example of the meaning of an “integral” part
of the conductive material 522 shown in Figure 18.
Also, there are several places in the specification that
the word “integral” can be found. This word is found in [0012]
on page 4 the specification, the phrase “integral plugs” is
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