Appeal No. 2004-0798
Application No. 09/929,849
The subject matter on appeal relates to a method for
forming one or more slots in a silicon wafer (claims 7-7 and 13-
19) and to a method for making ink jet printheads from a silicon
wafer having a device surface side and one or more ink feed vias
grit blasted therein for ink feed to the device surface side
thereof (claim 20). Further details of this appealed subject
matter are recited in representative claims 19 and 20, the only
independent claims on appeal, reproduced below:
19. In a method for forming one or more slots in
a silicon wafer containing a first surface and a
second surface opposite the first surface, the
improvement comprising the steps of:
forming a substantially permanent non-water
soluble first layer on the first surface of the wafer
from a material selected from the group consisting of
silane materials, photoresist materials, and a
combination of silane and photoresist materials;
applying a water-soluble protective material to
the first layer to form a protective second layer
thereon;
forming one or more slots in the silicon wafer
extending through the wafer from the first surface to
the second surface thereof; and
removing the water-soluble second layer from the
wafer.
20. In a method for making ink jet printheads
from a silicon wafer having a device surface side and
one or more ink feed vias grit blasted therein for ink
feed to the device surface side thereof, the ink jet
printheads including nozzle plates attached to the
device surface side of the wafer, providing nozzle
plate/chip assemblies, and TAB circuits or flexible
application, the examiner should attend to its proper processing
and entry.
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