Ex Parte Hart et al - Page 5


          Appeal No. 2004-0798                                                        
          Application No. 09/929,849                                                  

               It is important to emphasize that the initial burden of                
          establishing a prima facie case of obviousness rests on the                 
          examiner.  In re Oetiker, 977 F.2d 1443, 1445, 24 USPQ2d 1443,              
          1444 (Fed. Cir. 1992).                                                      
               To support the rejections, the examiner relies primarily on            
          a combination of three references, namely Rogers as a principal             
          reference and Verley and Murthy as teaching references to fill              
          the gaps between the claimed invention and Rogers.  Rogers                  
          describes a process for forming solid vias or electrical                    
          connections from the top plane of a substrate to the bottom                 
          plane of the substrate.  (Column 1, lines 6-8.)  Specifically,              
          Rogers teaches a process including the steps of: coating the                
          substrate with a water soluble polymer to protect the surface               
          from debris generated during a subsequent laser drilling step;              
          focusing a carbon dioxide laser operated at 30 watts on a 50                
          micron spot to perforate a location on which a via is to be                 
          centered; drilling a circular pattern around the perforation to             
          create holes 26 of desired diameter; removing the polymer                   
          coating along with the debris generated by the laser; scraping              
          away any residual alumina remaining at the perimeter of each                
          hole; metallizing both sides of the substrate by sputtering a               
          seed layer 27 in order to achieve continuous metallization                  
          inside the hole; masking the top and bottom surfaces with dry               

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