Appeal No. 2004-0798
Application No. 09/929,849
circuits electrically connected to the nozzle
plate/chip assemblies, the improvement comprising:
spin coating a substantially water-insoluble
first material on a the [sic] device surface side of a
silicon wafer to form a first layer thereon, the first
material being selected from the group consisting of a
silane material, a photoresist material, and a
combination of silane material and photoresist
material;
spin coating onto the first layer a substantially
water-soluble protective material to provide a second
layer on the first surface of the wafer;
grit blasting one or more ink vias in the wafer
extending from a second surface thereof to the device
surface side of the wafer; and
removing substantially all of the second layer
from the wafer.
The examiner relies on the following prior art references
as evidence of unpatentability:
Green et al. 4,009,113 Feb. 22, 1977
(Green)
Brewer et al. 4,950,583 Aug. 21, 1990
(Brewer)
Verley et al. 5,105,588 Apr. 21, 1992
(Verley)
Wachi et al. 5,286,703 Feb. 15, 1994
(Wachi)
Rogers et al. 5,454,928 Oct. 03, 1995
(Rogers)
Kamiyama et al. 5,677,063 Oct. 14, 1997
(Kamiyama)
Anderson et al. 5,719,605 Feb. 17, 1998
(Anderson)
Murthy et al. 6,045,214 Apr. 04, 2000
(Murthy)
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