Appeal No. 2004-0798
Application No. 09/929,849
film or liquid photoresist materials, leaving only the holes and
their upper and lower peripheries exposed; plating gold into the
holes; etching the resist film and metal layer; and raising the
temperature above the melting point of gold to reconfigure the
gold. (Column 2, line 31 to column 3, line 25; Figures 1 and 2A
to 2H.)
The examiner admits that the method described in Rogers
differs from the invention recited in appealed claim 19 in that
a substantially permanent non-water soluble first layer of a
material selected from the group consisting of silane materials,
photoresist materials, and a combination of silane and
photoresist materials is not formed on a first surface of the
wafer before a water-soluble protective material is formed on
the first layer. (Answer, page 3.) This difference
notwithstanding, the examiner alleges (id. at page 4) that
Murthy teaches “that it is known in the art of making ink-jet
printheads to coat the semiconductor substrate (12) with photo-
curable epoxy resin” and that “[i]t would have been obvious to
one of ordinary skill in the art [] to use the conventional
photoresist layer [] as shown by Murthy.” According to the
examiner (id.), “[o]ne of ordinary skill in the art would have
been motivated to use the photoresist layer [] in order to
enhance adhesion between the nozzle plate and substrate...”
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