Ex Parte TAKAHASHI et al - Page 9




         Appeal No.  2004-2192                                                      
         Application No. 09/414,520                                                 

         in response to introduction of a gas which contains at least               
         carbon and fluorine, and a gas species is generated which                  
         contains a carbon and fluorine according to a plasma                       
         dissociation, the plasma processing method comprising the steps            
         of:                                                                        
              generating a plasma, wherein said plasma generation is                
         effected using an electron cyclotron resonance system in which a           
         microwave having a frequency of from 300 MHz to 1 GHz is employed          
         and wherein a degree of plasma dissociation is an intermediate             
         degree and said gas species containing carbon and fluorine is              
         generated fully in the plasma, and controlling a temperature of a          
         region which forms a side wall of said vacuum processing chamber           
         to have a range of 10°C to 120°C.                                          
                                                                                   
         7.  A plasma processing method according to claim 6, wherein said          
         plasma generation produces a plasma in which an electron energy            
         is a range of from 0.25 eV to 1 eV.                                        

         9.  A plasma processing method according to claim 6, wherein in            
         said plasma generation, a drive of a plasma exiting power supply           
         is carried out intermittently.                                             

         10.  A plasma processing apparatus according to Claim 6, Claim 7           
         or Claim 9 wherein as a means for adjusting a temperature of said          
         vacuum wall, a temperature adjusted coolant medium is used.                














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