Appeal No. 2005-0155
Application No. 09/760,884
fall together.”1 Therefore, for purposes of this appeal, we
select claim 10 from all the claims on appeal and decide the
examiner’s rejection based on this claim alone consistent with
37 CFR § 1.192(c)(7)(2003) and 37 CFR § 41.37(c)(1)(vii)(2004).
Claim 10 is reproduced below:
10. A method of fabricating an electronic structure which
comprises forming an insulating material on a
substrate;
lithographically defining and forming recesses for
lines and/or via having sidewalls and bottom surface in the
insulating material in which interconnection conductor
material will be deposited;
depositing a barrier layer on sidewalls and bottom
surfaces of the recesses;
providing an electroplating bath comprising:
a source of cupric ions,
a complexing agent,
cyanide ions,
a stabilizing agent,
and a pH of at least 12.89;
providing an electrical current sufficient to provide a
current density of from about 5 to about 25 milliamps/cm2;
and
electroplating copper directly on said barrier layer.
1See the Advisory Action mailed March 19, 2004.
2
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