Appeal No. 2005-0155 Application No. 09/760,884 also correctly finds that Ting teaches the advantages of employing stabilizers, including those containing cyanide ions, in the electroplating bath of the type described in Chan in a similar method. See the Answer, page 7. Based on the above teachings, the examiner determines that one of ordinary skill in the art would have been led to employ the lithographic techniques taught by Landau for making trenches or vias described in Chen and employ the stabilizers taught by Ting as part of the electroplating bath described in Chen, motivated by a reasonable expectation of obtaining the advantages taught by Landau and Ting. See the Answer, pages 6-7. The appellants do not specifically challenge the examiner’s determination that one of ordinary skill in the art would have been led to employ the lithographic techniques taught by Landau and the stabilizers taught by Ting in the electronic structure fabricating method described in Chen. See the Brief and the Reply Brief in their entirety. Rather, the appellants specifically argue that Chen, Landau, and Ting teach away from electroplating copper directly onto the barrier layer. See the Brief and the Reply Brief in their entirety. We are not persuaded by this argument. 5Page: Previous 1 2 3 4 5 6 7 8 9 NextLast modified: November 3, 2007