Ex Parte Andricacos et al - Page 5



          Appeal No. 2005-0155                                                        
          Application No. 09/760,884                                                  

          also correctly finds that Ting teaches the advantages of                    
          employing stabilizers, including those containing cyanide ions,             
          in the electroplating bath of the type described in Chan in a               
          similar method.  See the Answer, page 7.                                    
               Based on the above teachings, the examiner determines that             
          one of ordinary skill in the art would have been led to employ              
          the lithographic techniques taught by Landau for making trenches            
          or vias described in Chen and employ the stabilizers taught by              
          Ting as part of the electroplating bath described in Chen,                  
          motivated by a reasonable expectation of obtaining the advantages           
          taught by Landau and Ting.  See the Answer, pages 6-7.                      
               The appellants do not specifically challenge the examiner’s            
          determination that one of ordinary skill in the art would have              
          been led to employ the lithographic techniques taught by Landau             
          and the stabilizers taught by Ting in the electronic structure              
          fabricating method described in Chen.  See the Brief and the                
          Reply Brief in their entirety.  Rather, the appellants                      
          specifically argue that Chen, Landau, and Ting teach away from              
          electroplating copper directly onto the barrier layer.  See the             
          Brief and the Reply Brief in their entirety.  We are not                    
          persuaded by this argument.                                                 

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