Appeal No. 2005-0155
Application No. 09/760,884
also correctly finds that Ting teaches the advantages of
employing stabilizers, including those containing cyanide ions,
in the electroplating bath of the type described in Chan in a
similar method. See the Answer, page 7.
Based on the above teachings, the examiner determines that
one of ordinary skill in the art would have been led to employ
the lithographic techniques taught by Landau for making trenches
or vias described in Chen and employ the stabilizers taught by
Ting as part of the electroplating bath described in Chen,
motivated by a reasonable expectation of obtaining the advantages
taught by Landau and Ting. See the Answer, pages 6-7.
The appellants do not specifically challenge the examiner’s
determination that one of ordinary skill in the art would have
been led to employ the lithographic techniques taught by Landau
and the stabilizers taught by Ting in the electronic structure
fabricating method described in Chen. See the Brief and the
Reply Brief in their entirety. Rather, the appellants
specifically argue that Chen, Landau, and Ting teach away from
electroplating copper directly onto the barrier layer. See the
Brief and the Reply Brief in their entirety. We are not
persuaded by this argument.
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