Appeal No. 2005-0181
Application No. 09/781,631
APPENDIX
31. A silica-filled Flip-Chip-Attach (FCA) encapsulant
composition for use between an integrated circuit chip and an
organic or ceramic substrate, comprising a “core-shell” substance
including a fine powder, whose particles each have an outer shell
with a glass transition temperature above room temperature and a
core with a glass transition temperature below room temperature.
35. The silica-filled FCA encapsulant composition in accordance
with claim 31, including at least one epoxy resin material
selected from a group of epoxy resin materials consisting of:
polyimides, cyanate esters, and combinations thereof.
36. A silica-filled flip-chip-attach encapsulant composition
comprising by weight:
a cycloaliphatic epoxy resin of between approximately 14 and
25 percent;
a methyl-hexahydrophthalic anhydride of between
approximately 14 and 25 percent;
at least one aliphatic polyol substance of between
approximately 0 and 2 percent;
2-ethyl-4-methylimidazole of less than approximately 1
percent;
a filler powder comprising silica (Si02) in a range of
between approximately 40 and 60 percent, with a filler particle
size being less than approximately 25 microns; and
an epoxy silane of approximately 0.3 and 0.5 percent.
41. The silica-filled FCA encapsulant composition in accordance
with claim 31, wherein said composition has a toughness of
between approximately 800 and 2,500 psi-in1/2.
42. A silica-filled flip-chip-attach encapsulant composition for
use between an integrated circuit chip and a ceramic or organic
substrate, comprising:
a) silica fill in a range of approximately between 40 and
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