Appeal No. 2005-0181
Application No. 09/781,631
60 percent by weight of the total encapsulant composition; and
b) an epoxy resin and an anhydride, each respectively in an
approximate weight range of between 14 and 25 percent by weight
of the total encapsulant composition.
52. A method of encapsulating an integrated circuit (IC) chip
and an organic substrate in order to form a chip carrier, the
steps comprising:
applying a silica-filled encapsulant composition to an IC
chip and an organic substrate, said composition comprising
particles having a core material with a glass transition
temperature, Tg, below room temperature and a core-shell material
substantially surrounding said core material, said core-shell
material having a Tg above room temperature;
curing said encapsulated IC chip and said substrate; and
reflowing solder joints between said IC chip and said
substrate.
54. The method of encapsulating an IC chip and a ceramic
substrate associated therewith to form a flip-chip-attach (FCA)
configuration in accordance with claim 52, wherein said
encapsulant composition has a coefficient of thermal expansion
(CTE) approximately three times that of said ceramic substrate.
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