The opinion in support of the decision being entered
today was not written for publication in a law journal
and is not binding precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
Ex parte JOHN H. GIVENS
Appeal No. 2005-0479
Application No. 08/801,812
ON BRIEF
Before KIMLIN, OWENS and WALTZ, Administrative Patent Judges.
KIMLIN, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1-28
and 36-63. Claims 1 and 46 are illustrative:
1. A method for manufacturing an interconnect structure
comprising:
forming a recess within a dielectric material situated on a
semiconductor lower substrate, said recess extending below a top
surface of said dielectric material;
forming a diffusion barrier layer on the recess within the
dielectric material;
forming a seed layer on the diffusion barrier layer, the
diffusion barrier layer being composed of a material having a
-1-
Page: 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007