Ex Parte Sambasivam et al - Page 1



          The opinion in support of the decision being entered today                  
          was not written for publication and is not binding precedent                
          of the Board.                                                               


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                     __________                                       
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                     __________                                       
                             Ex parte MAHESH SAMBASIVAM                               
                             and VASSOUDEVANE LEBONHEUR                               
                                     __________                                       
                                Appeal No. 2005-2073                                  
                               Application 10/033,854                                 
                                     __________                                       
                                      ON BRIEF                                        
                                     __________                                       
          Before THOMAS, HAIRSTON, and JERRY SMITH, Administrative Patent             
          Judges.                                                                     
          JERRY SMITH, Administrative Patent Judge.                                   


                                 DECISION ON APPEAL                                   
               This is a decision on the appeal under 35 U.S.C. § 134 from            
          the examiner’s rejection of claims 1-20, which constitute all the           
          claims in the application.                                                  
               The disclosed invention pertains to a method of fabricating            
          a microelectronic package.                                                  

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