Appeal No. 2005-2073
Application No. 10/033,854
Representative claim 1 is reproduced as follows:
1. A method of fabricating a microelectronic package,
comprising:
providing a substrate having a first surface, an opposing
second surface, and a plurality of lands disposed on said first
surface;
forming a through-hole extending from said substrate first
surface to said substrate second surface;
providing a microelectronic die having an active surface, a
back surface, and a plurality of pads disposed on said active
surface in a corresponding relationship to said plurality of
substrate lands;
electrically attaching said plurality of substrate lands to
said plurality of corresponding microelectronic die pads with a
plurality of conductive bumps,
disposing an underfill material through said through-hole
such that said underfill material is dispersed by capillary
action between said microelectronic die active surface and said
substrate first surface.
The examiner relies on the following references:
Akram et al. (Akram) 5,766,982 June 16, 1998
Cha et al. (Cha) 6,242,798 June 05, 2001
The admitted prior art described in appellants’ application.
Claims 1-20 stand rejected under 35 U.S.C. § 103(a). As
evidence of obviousness the examiner offers the admitted prior
art in combination with Akram and Cha.
2
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