Appeal No. 2005-2073
Application No. 10/033,854
material can be dispersed into the gap through a through hole or
from the edges of the flip-chip.
In our view, the background teachings of Akram that a
through hole can be used to disperse the underfill material
instead of dispersing the material from the edges of the flip-
chip would have suggested modifying the admitted prior art to use
the through hole form of dispersion. But even if Akram requires
that the assembly be tilted, we are still of the view that the
claimed invention would have been obvious to the artisan.
Specifically, Akram teaches that the underfill material in the
tilted assembly is dispersed by fluid pressure, capillary action
and gravity [column 4, line 60 to column 5, line 4]. Thus, even
though the assembly is tilted, Akram teaches that the underfill
material is still at least partly dispersed by capillary action.
Therefore, we agree with the examiner that not only would it have
been obvious to the artisan to modify the admitted prior art with
the teachings of Akram, but the modification taught by Akram does
result in the invention of representative claim 1.
In summary, we have sustained the examiner’s rejection of
the claims on appeal. Therefore, the decision of the examiner
rejecting claims 1-20 is affirmed.
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