Appeal No. 2005-2073
Application No. 10/033,854
prior art and Akram are combined, the claimed invention results
[answer, pages 6-10].
We will sustain the examiner’s rejection of claims 1-20
based on the teachings of the admitted prior art and Akram. The
admitted prior art teaches a dispensing needle for dispersing the
underfill material in the gap formed by the die active surface
and the substrate surface [application, Figure 13]. The assembly
of Figure 13 appears to be situated horizontally. Akram teaches
that underfilling a flip-chip oriented in the horizontal
direction causes the underfill material to have bubbles, air
pockets or voids [column 1, line 65 to column 2, line 1]. Akram
solves this problem by applying the underfill material to the
assembly while it is tilted in the vertical direction. Akram
teaches that it was well known in the prior art for underfill
material to be dispersed into the gap from the sides of the flip-
chip or by way of a through hole [column 1, lines 45-58]. Akram
also teaches these alternatives by the embodiments of Figures 1
and 2 and the embodiments of Figures 5-7. Thus, our first
finding is that the artisan would have been motivated to combine
the teachings of Akram with the admitted prior art in order to
solve the underfill problem related to horizontal assemblies.
Our second finding is that Akram teaches that the underfill
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