The opinion in support of the decision being entered
today was not written for publication in a law journal
and is not binding precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
Ex parte LOTHAR HENNEKEN and SILVAN HIPPCHEN
Appeal No. 2006-0264
Application No. 10/217,064
ON BRIEF
Before KIMLIN, PAK and WALTZ, Administrative Patent Judges.
KIMLIN, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1-16.
Claim 1 is illustrative:
1. A method for depositing an adhesion-promoting layer on a
spatially bounded metallic layer of a chip, comprising:
depositing the adhesion-promoting layer by at least one wet-
chemical process using a multi-component process bath;
analyzing a concentration of an inhibitor of the multi-
component process bath during the wet-chemical process in at
least approximately continuous manner; and
adjusting the concentration of the inhibitor to a constant
value, the adjusting of the inhibitor concentration being
-1-
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