Appeal No. 2006-0415
Application No. 10/267,200
1 A typical representative of a solventless adhesive which is
2 preferably used according to the present invention is that
3 known as a two (or multi) reactive component adhesive, the
4 two (or more) components of which react together in situ to
5 form a cross-linked adhesive polymer. Examples of this kind
6 of adhesive polymer include a hydroxylated polyester or
7 polyether which is reacted with a di-or polyisocyanate and an
8 epoxy resin which is reacted with compounds containing at
9 least two active hydrogen atoms (Col. 1, lines 25-
10 34)(emphasis added).
11
12 The avoidance of solvent is to “prevent the poisoning of
13 operators by the solvent vapors and to avoid all risk of fire.”
14 Water is classified as a solvent to be avoided by De Keyser
15 (column 1, lines 19-24).
16 De Keyser is directed towards the machinery and method for
17 applying the solventless adhesive. Other than keeping away from
18 the solvents, and encouraging the use of multi-component reactive
19 adhesives, contrary to the Appellant’s position, De Keyser is
20 silent as to any particular adhesive “preferences.” It lists
21 only two types as exemplary of the larger group of potential
22 resins. These two examples form a very small genus.
23 We also note that one of the two adhesive species in this
24 genus is an epoxy resin reacted with compounds containing at least
25 two active hydrogen atoms. This epoxy resin was found by the
26 examiner to be an adhesive without isocyanate-functionalized
27 compounds, in that the epoxy resin is reacted with compounds
28 containing at least two active hydrogen atoms. (Rejection,
9
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