Appeal No. 2006-0415
Application No. 10/267,200
1 additionally found that De Keyser describes the exclusion of
2 water-based glues and resins dissolved in at least one volatile
3 organic adhesive. The examiner has further found that De Keyser
4 describes a two-component non-isocyanate reactive component
5 adhesive which react in situ to form a crosslinked adhesive
6 polymer. Finally, the examiner has found that De Keyser describes
7 a solventless adhesive having a low viscosity as a low viscosity
8 is necessary to apply the adhesive (Examiner’s Answer, May 20,
9 2005, pages 4-5).
10 Marten, on the other hand, is said to describe an epoxy
11 composition in which water and solvent are optional. The epoxy is
12 decribed as containing low viscosity bisphenol A resin and a
13 curing agent which includes active hydrogen atoms such as
14 polyamidoamine. The low viscosity is said to enable bulk mixing
15 without use of diluents. (Examiner’s Answer, page 6, last
16 paragraph).
17 The examiner then concludes that it would have been obvious
18 to one of ordinary skill in the art at the time the invention was
19 made to use the claimed active hydrogen curing agent in that De
20 Keyser suggests a curing agent having at least two active hydrogen
21 atoms. The examiner also finds it would have been obvious to one
22 of ordinary skill in the art at the time the invention was made to
23 use the claimed active hydrogen curing agents for epoxy-based
5
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