Ex Parte Paek - Page 1



              The opinion in support of the decision being entered today was not written                                
                      for publication and is not binding precedent of the Board.                                       


                      UNITED STATES PATENT AND TRADEMARK OFFICE                                                        
                                          ____________                                                                 
                           BEFORE THE BOARD OF PATENT APPEALS                                                          
                                       AND INTERFERENCES                                                               
                                           ____________                                                                
                                      Ex parte JONG SIK PAEK                                                           
                                           ____________                                                                
                                       Appeal No. 2006-0450                                                            
                                   Application No. 10/044,141                                                          
                                           ____________                                                                
                                              ON BRIEF                                                                 
                                           ____________                                                                
           Before BARRETT, LEVY, and MACDONALD, Administrative Patent Judges.                                          
           LEVY, Administrative Patent Judge.                                                                          


                                       DECISION ON APPEAL                                                              
                 This is a decision on appeal from the examiner's final                                                
           rejection of claims 1-21, which are all of the claims pending in                                            
           this application.                                                                                           
                 We AFFIRM.                                                                                            
                                           BACKGROUND                                                                  
                 The appellant's invention relates to a semiconductor package                                          
           with stacked dies (specification, page 1).                                                                  














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