Appeal No. 2006-0450 Παγε 8
Application No. 10/044,141
Takahashi for a teaching of this feature, for the purpose of
preventing short circuits.
Appellant (brief, page 10) does not argue the combinability
of the references, but rather argues to the effect that Takahashi
does not teach the first and second protective layers as recited
in the claim, and that Takahashi does not teach forming a
protective layer on the surface of a lead other than the
prescribed region including a bump land. We disagree. Firstly,
Chun-Jen is relied upon for the two leads and the bump lands, as
well as the solder joints. Takahashi (figure 1) is relied upon
for the teaching of the protective layers. Takahashi discloses a
single semiconductor layer 16 and lead 10 in figure 1. In
addition, we find from the disclosure of Takahashi (pages 1 and
2), that:
that the surface of a plated layer 12 of an inner lead
10 of a film carrier system package is
covered with an insulative coating film
13. When the inner lead 10 is bonded to
a semiconductor element 16, the
insulative coating film 13 only at the
bonding part of the inner lead 10 is
inner lead 10 is bonded to a protruding
type electrode 17 of a
semiconductor element 16. Hence
electric troubles due to short-circuit
are not generated, when the gap between
the inner lead 10 and the
semicondutorr element 16 is made very
narrow, or
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