Appeal No. 2006-0450 Παγε 2
Application No. 10/044,141
Claim 1 is representative of the invention, and is
reproduced as follows:
1. A semiconductor package comprising:
a plurality of leads, each of the leads defining:
a generally planar first surface;
a generally planar second surface disposed in
opposed relation to the first surface; and
a generally planar third surface disposed in
opposed, substantially parallel relation to the second
surface and laterally offset outwardly relative to
the first surface;
a first semiconductor die defining opposed top and
bottom surface;
a second semiconductor die defining opposed top
and bottom surfaces;
a plurality of conductive connectors electrically
and mechanically connecting the first semiconductor die
to the first surfaces of the leads and the second
semiconductor die to the second surfaces of the leads; and
an encapsulating portion applied to and at least
partially encapsulating the leads, the first and second
semiconductor dies, and the conductive connectors
such that at least the first and second surfaces of each of
the leads are covered by the encapsulating portion.
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