Appeal No. 2006-0450 Παγε 9
Application No. 10/044,141
even when the inner lead 10 comes into contact with
the semicondutor element. When the inner lead 10 is
bent and brought into contact with the adjacent inner
lead 10, short-circuit can be prevented by forming
the insulative coating film 13.”
From this disclosure that the protective layer is melted only at
the bonding part during the bonding process, we find that
Takahashi would have suggested to an artisan the following
language of claim 6:
a first protective layer formed on at least a portion
of the first surface thereof other than for the prescribed
region including the first bump land; and
a second protective layer formed on at least a portion
of the first second surface thereof other than for the
prescribed region including the second bump land.
Accordingly, the rejection of claim 7 under 35 U.S.C. § 103(a) is
affirmed.
Turning to claim 9, appellant asserts (brief, pages 11 and
12) that in Takahashi, if the insulative coating film does not
sufficiently melt, a good electrical connection is not assured.
We are not persuaded by appellant’s assertion because there is no
evidence in the record of the protective layer failing or
possibly failing to melt at the bond area. We find appellant’s
assertion to be unfounded speculation, unsupported by evidence in
the record, and will sustain the rejection of claim 9 for the
reasons we affirmed claim 7.
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