Appeal No. 2006-1663
Application No. 09/871,883
outer surface, and a top surface, the top surface of said upper edge
substantially coplanar with a top surface of said dielectric layer;
an upper level wire having a side and a bottom and a via
integrally formed in the bottom of said upper level wire, said via have
a side and a bottom, said upper level wire and said via each
comprising an upper core conductor and an upper conductive liner,
said upper conductive liner on the side and the bottom of said upper
level wire and on the side and bottom of said via, at least a portion of
the bottom of said via extending below a top surface of said lower
wire level; and
said upper conductive liner on the bottom of said via in contact
with said lower core conductor and also in contact with both the inner
surface and the outer surface of said upper edge of said lower
conductive liner in a liner-to-liner contact region.
20. An interconnect structure, comprising:
a lower level wire in a dielectric layer, said lower level wire
having a side and a bottom, said lower level wire comprising a lower
core conductor and a lower conductive liner, said lower conductive
liner on the side and the bottom of said lower level wire, said lower
conductive liner having an upper edge having an inner surface, an
outer surface, and a top surface, the top surface of said upper edge
substantially coplanar with a top surface of said dielectric layer;
an upper level wire having a side and a bottom and an array of
vias integrally formed in the bottom of said upper level wire, each via
of said array of vias having a side and a bottom, said upper level wire
and each via comprising an upper core conductor and an upper
conductive liner, said upper conductive liner on the side and the
bottom of said upper level wire and on the side and bottom of each
via, at least a portion of the bottom each via extending below the top
surface of said lower wire level; and
said upper conductive liner on the bottom of each via of a first
portion of said array of vias in contact with said lower core conductor
and each via of a second portion of said array of vias in contact with
said lower core conductor and also in contact with both the inner
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