Appeal No. 2006-1663
Application No. 09/871,883
lower conductive liner (215) on the side and the bottom of said lower level wire
(200), said lower conductive liner having an upper edge (285) having an inner
surface (290A), an outer surface (290B), and a top surface (290C), the top surface
(290C) of said upper edge (285) substantially coplanar with a top surface of said
dielectric layer (245); an upper level wire (205) having a side and a bottom, said
upper level wire (205) comprising an upper core conductor (230) and an upper
conductive liner (225), said upper conductive liner (225) on the side and the
bottom of said upper level wire (205), at least a portion of the bottom of said upper
level wire (205) extending below a top surface of said lower level wire (200); and
said upper conductive liner (225) in contact with said lower core conductor (220)
and also in contact with both the inner surface (290A) and the outer surface (290B)
of said upper edge of said conductive liner (215) in a liner-to-liner contact region.
Appellants’ Figures 4A and 4B are reproduced below:
Appellants’ Figure 4A depicts a cross-sectional view of an embodiment of
Appellants’ dual-damascene via interconnect.
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