Appeal No. 2006-1663
Application No. 09/871,883
material-to-encapsulation material structure with Farrar’s via configuration (i.e., in
Farrar’s Figure 3G, reference numeral 328 are vias, and in Figure 3K, reference
numeral 334 (i.e., upper conductive liner) coats the inside of via 328 and contacts
the barrier layer 314 (i.e., lower conductive liner)). Havemann’s overlapping
encapsulation layer 48 (i.e., upper conductive liner) with encapsulation material 36
(i.e., lower conductive liner) structure is combined with Farrar’s “liner-to-liner
contact region” (i.e., barrier/adhesion layers 334 and 314 in Figure 3K) to produce
an interconnect structure “without mechanical defects” (i.e., without deleterious
mechanical effects). (Answer 6). Moreover, the motivation the Examiner provides
is found in the disclosure of Havemann. (Answer 6, Havemann, abstract).
We affirm the § 103(a) rejection of claim 10 and non-argued claims 11-13,
15 and 19, which depend therefrom.
CLAIMS 16-18
Claim 16 requires the liner-to-liner contact region to have a second portion
co-extensive with said lower conductive liner on a portion of a second side of the
lower level wire under the via. Claim 17 recites the liner-to-liner contact region
has a third portion coextensive with the lower conductive liner on an end of the
lower level wire under the via. Claim 18 recites the liner-to-liner contact region
comprises a first portion coextensive with the lower conductive liner on a portion
of a first side of the lower level wire under the via and a second portion
coextensive with said lower conductive liner on a portion of an end of said lower
level wire under said via.
The Examiner rejects claims 16-18 under 35 U.S.C. § 103(a) over Farrar in
view of Havemann. It is apparent that the Examiner applies the same rationale
17
Page: Previous 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Next
Last modified: November 3, 2007