Appeal No. 2006-1870 Παγε 10
Application No. 10/100,901
to a method of chemical-mechanical polishing of substrates useful
in the manufacture of semiconductor devices, memory disks or the
like (col. 2, lines 62-65). It is disclosed that the device is
used to polish the surface of a semiconductor device or
integrated circuit (col. 4, lines 15-21). From the disclosure of
using the device to polish a semiconductor device or integrated
circuit, we find that the polishing device of James will
inherently be capable of polishing the back of a semiconductor
wafer to remove processing distortion caused by grinding the back
side of the wafer. In addition, James discloses that the
polishing tool includes a support member (col. 13, lines 1-5
where it is recited that “[t]he pad layer (pad matrix containing
particles) can be partially or wholly solidified upon a belt, a
sheet, a web, a coating roll (such as a rotogravure roll, a
sleeve mounted roll) or a die. The substrate can be composed of
metal (e.g., nickel), metal alloys, ceramic or plastic.”
James additionally discloses a support by reciting (col. 20,
lines 25-27) that “the polishing pad comprises both a rigid
supporting layer and a flexible supporting layer.” From this
disclosure and the disclosure that figure 1 that polishing pad 6
comprising backing or support layer 8 having a front surface 9,
with abrasive coating 10 bonded to the front surface 9 of backing
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