Appeal No. 2006-1870 Παγε 2
Application No. 10/100,901
BACKGROUND
The appellants’ invention relates to a polishing tool and
method, and an apparatus for using the tool (specification, page
1).
Claim 1 is representative of the invention, and is reproduced as
follows:
A polishing tool for polishing a back side of a
semiconductor wafer to remove processing distortion caused
by grinding of the back side, said tool comprising:
a support member; and
polishing means fixed to the support member, and
wherein the polishing means is composed of felt having
a density of 0.20 g/cm3 or more and a hardness of 30 or
more, and abrasive grains dispersed in the felt.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Jefferies et al. 5,369,916 Dec. 6, 1994
(Jefferies)
James et al. (James) 6,069,080 May 30, 2000
Claims 1-6, 8 and 10 stand rejected under 35 U.S.C. § 103(a)
as being unpatentable over Jefferies.
Claim 9 stands rejected under 35 U.S.C. § 103(a) as being
unpatentable over Jefferies in view of James.
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