Appeal 2006-2671
Application 09/508,572
thickness that can accommodate circuit components, arguing the
“unevenness of layer 20 would not be structured so as to accommodate
circuit components” as claimed (id. 3). In this respect, Appellants contend
“[n]ot any depression of any size and any contour can accommodate circuit
components” (id.). Appellants contend the structure illustrated in Fig. 4 is
for the production of a semiconductor device illustrated in Fig. 5, wherein
metal layer 22 reflows uniformly in opening 14 to form an electrical contact
point within the integrated circuit 9 (id. 3-4).
With respect to claim 10, Appellants contend Merchant’s purpose of
eliminating unwanted unevenness teaches away from the claimed thickness
(id. 4). With respect to claim 14, Appellants contend the Examiner is relying
on Merchant’s Fig. 5 which does not meet any of the limitations of claim 7
(id. 5). With respect to claim 15, Appellants contend the Examiner has not
established a difference in the electrical potential of the specified layers (id.).
Appellants reply with the same contentions with respect to
MacNaughton (Reply Br. 5-8).
The plain language of independent claim 7 specifies a substrate board
for a micro hybrid integrated circuit which comprises at least, inter alia, a
ceramic body covered by any metallic skin having at least one area of
reduced layer thickness forming any manner of at least one depression of
any depth capable of accommodating any manner of components of any
manner of micro hybrid integrated circuit. We determine the term
“depression” when considered in light of the disclosure in the Specification
would have its ordinary, dictionary meaning of “[a]n area that is sunk below
7
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