Appeal 2007-0707
Application 10/799,468
a support-element-feeder portion situated and configured to provide a
support element;
an adhesive-film-attachment portion comprising a displaceable block;
a cutting blade situated relative to the block;
an adhesive-film-drive mechanism situated and configured to advance
the length of adhesive film to the adhesive-film-attachment
portion to place a desired portion of the adhesive film on the
block; and
a coverlay-removal mechanism coupled to the adhesive-film-drive
mechanism and configured to remove the coverlay portion from
the desired portion of the adhesive film in synchrony with the
adhesive-film-drive mechanism placing the desired portion of
the adhesive film on the block;
wherein displacement of the block a first distance causes the cutting
blade to cut the adhesive-film strip from the length of adhesive
film, and displacement of the block a second distance applies
the cut adhesive-film strip to the support element provided by
the support-element-feeder portion.
The Examiner relies upon the following references as evidence of
obviousness:
Wroblewski US 3,788,572 Jan. 29, 1974
Sakumoto US 4,933,219 Jun. 12, 1990
Tsukagoshi (as translated) JP 11-123471 May 1999
VanNortwick US 6,025,212 Feb. 15, 2000
Saito US 6,080,263 Jun. 27, 2000
Appellant’s claimed invention is directed to an apparatus for applying
an adhesive-film strip comprising a coverlay to a support element in the
manufacture of a semiconductor. The apparatus comprises a coverlay-
removal mechanism, a displaceable block for attaching the adhesive film,
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