Appeal 2007-0828
Application 10/456,455
INTRODUCTION
The claims are directed to an interposer for use in a semiconductor
assembly. An interposer is used for attachment of a semiconductor die to a
carrier substrate. (See Specification ¶ 2.) Claim 1 is illustrative:
1. An interposer for use in a semiconductor assembly,
comprising:
an upper surface:
a perimeter wall substantially encircling the upper surface to
form a recess, the recess having at least a first set of alternate upper
electrical contact pads located therein, the at least a first set of
alternate upper electrical contact pads comprising at least a first upper
electrical contact pad and at least a second upper electrical contact
pad; and
a lower surface having at least a first lower electrical
connection pad located thereon, the at least a first lower electrical
connection pad electrically connected to the at least a first upper
electrical contact pad and the at least a second upper electrical contact
pad.
The Examiner relies on the following prior art references to show
unpatentability:
Lin (Lin ′203) US 5,436,203 Jul. 25, 1995
Lin (Lin ′999) US 5,468,999 Nov. 21, 1995
The rejection as presented by the Examiner is as follows:
1. Claims 1 and 4-18 are rejected under 35 U.S.C § 103(a) as
unpatentable over Lin ′999 and Lin ′203.
Claims 19-21 are objected to as being dependent upon a rejected base
claim, but allowable if rewritten in independent form.
Claims 2 and 3 have been canceled.
2
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