Appeal 2007-0828
Application 10/456,455
at different potentials and provided for different purposes (e.g., ground and
power supply), the pads are electrically connected through semiconductor
die 42 even if there are electrical elements within the die that separate the
bond pads. A power supply voltage and a ground potential within the same
semiconductor chip are electrically connected, at least for the reason that
conventional electrical current flows from the power supply source to the
ground plane.
What a reference teaches is a question of fact. In re Baird, 16 F.3d
380, 382, 29 USPQ2d 1550, 1552 (Fed. Cir. 1994); In re Beattie, 974 F.2d
1309, 1311, 24 USPQ2d 1040, 1041 (Fed. Cir. 1992). We are not persuaded
that the Examiner’s findings with respect to Lin ′999 are erroneous.
Appellant provides a heading in the Brief (at 13) that suggests there is
no reasonable expectation of success in combining Lin ′999 and Lin ′203.
First, as we have noted, the teachings of Lin ′203 can be considered merely
cumulative in the rejection of instant claim 1; a combination of references is
not required. The remarks under the heading are based, however, on the
position that some modification of the electrical contact pads of Lin ′999 is
necessary to demonstrate a prima facie case of obviousness. Appellant has
not shown any modification to be necessary, because Appellant has not
shown error in the Examiner’s findings with respect to Lin ′999.
We have considered all of Appellant’s arguments in support of
claim 1. We sustain the rejection of the claim. Depending claims 4 through
18, not separately argued, fall with claim 1. See 37 C.F.R. §
41.37(c)(1)(vii).
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