Appeal 2007-1228
Application 10/150,458
1 Collins 1 differs from Applied Materials' Fig. 5 embodiment in that
2 Collins 1 does not describe “an RF insulator disposed between the top RF
3 coil and the cold plate, the RF insulator having a heater integrated therein”.
4 Collins 1, Tomoyasu, Imahashi, and Niori disclose wafer heating
5 devices where a coil or heat generating resistance is embedded within a
6 material.
7 For example, Tomoyasu discloses a heater 3062 made by inserting a
8 conductive resistance heating unit into an insulating sintered body made of
9 aluminum nitride for use in a suscepter 305 used to heat a treated substrate
10 W (wafer). Tomoyasu, col. 10:44-50.
11 Imahashi discloses a heating means 76 made of “a conductive
12 resisting heat generating body… inserted in an insulating sintered body
13 of, e.g. aluminum nitride” for hearing the surface of a wafer Imahashi, col.
14 11:20-31.
15 Niori discloses a wafer heating device 1 with a heat generating
16 resistive element 3 embedded within a ceramic substrate 2. Niori,
17 Col. 4:11-17.
18 ANALYSIS
19 As a result of the requirement for election, examination was limited to
20 the species (or embodiment) of Fig. 5. Consistent with our holding in Ex
21 parte Ohsaka, 2 USPQ2d 1460 (Bd. Pat. App. & Int. 1987), we limit our
22 consideration to the Fig. 5 embodiment, recognizing that additional
23 examination of the non-elected species will follow. During that
24 examination, the Examiner may find art applicable not only to the non-
2 We were unable to find reference number “306” within figure 8 of
Tomoyasu but understand the heater to be within the susceptor 305.
7
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