Appeal 2007-2501
Application 10/026,917
1 Hwang
2 5. The Examiner found that Hwang describes placing a
3 semiconductor substrate 26 on a transportable electrostatic carrier item
4 (chuck) 38. (Final Rejection 2 and Answer 3).
5 6. The Examiner further found that the semiconductor substrate 26
6 remains on the chuck 38 during processing steps that include moving the
7 arm and wafer and then rapidly moving the arm into the process chamber.
8 (Final Rejection 2-3 and Answer 3).
9 7. The Examiner also found that the processing steps of moving the
10 arm and wafer and then rapidly moving the arm into the process chamber are
11 performed under a single power application and “without any additional
12 external power supply to recharge the transportable electrostatic chuck
13 during long or several process steps. . . .” (Answer 3:10).
14 8. Hwang describes an arm 20 (Fig. 1) used for transferring a
15 semiconductor substrate 26 into a chamber 54 (Fig. 5).
16 9. Concentrically disposed within contact member 34 of the arm 20 is
17 a plate 38 (Fig. 2) (Hwang 4:41-48).
18 10. A power source 28 is coupled with the arm 20 through electrical
19 leads 32 (Hwang 4:56-58).
20 11. One of the leads 32 is connected with contacting member 34 and
21 the other lead is connected to plate member 38 (Hwang 4:59-62 and Fig. 1).
5
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Last modified: September 9, 2013