Compaq Computer Corporation and Subsidiaries - Page 4




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               Compaq U.S. had three sources of PCA's.  Compaq U.S.                   
          manufactured PCA's itself.  In addition, Compaq U.S. purchased              
          PCA's from Compaq Asia and from various unrelated PCA                       
          subcontractors (unrelated subcontractors) that were primarily               
          located in the United States.  Approximately half of the Compaq             
          U.S. 1991 through 1992 PCA requirements were manufactured by                
          Compaq U.S. or purchased from unrelated subcontractors, and the             
          other half were manufactured by Compaq Asia.                                
          PCA Technology                                                              
               PCA's are characterized by the types of components placed on           
          the printed circuit board.  Components are attached to the board            
          through soldering, and components soldered to the surface of the            
          printed circuit board are known as "surface-mount" (SMT)                    
          components.  Components having leads that are inserted through              
          holes in the printed circuit board and then soldered to the board           
          are "through hole" components.  PCA's containing only surface-              
          mount components are known as SMT PCA's, and PCA's containing               
          only through hole components are known as "through hole" PCA's.             
          PCA's that use both through hole and SMT components are known as            
          "mixed technology" PCA's.                                                   
               Although SMT components are generally smaller than their               
          through hole counterparts, there is no functional difference                
          between them.  The SMT process, however, is the newer process and           
          packs components densely on both sides of the printed circuit               





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Last modified: May 25, 2011