Compaq Computer Corporation and Subsidiaries - Page 6




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          incorporates video cameras that examine each chip's and PCA's               
          rotation and orientation to ensure precise placement.                       
          Compaq U.S. used Fuji placement equipment and generally required            
          unrelated subcontractors to use the same equipment.  In addition,           
          SMT manufacturing requires well-trained machine operators to                
          follow detailed manufacturing procedures and experienced                    
          engineers to supervise and control the manufacturing process.               
               Through hole technology is less reliant on manufacturing               
          equipment.  Accordingly, through hole components may be inserted            
          manually or by machines, depending upon the number of components            
          on the PCA.  When there are very few through hole components or             
          odd-shaped through hole components, the through hole components             
          are inserted manually.                                                      
          Compaq U.S. Processes                                                       
               Compaq U.S. used many advanced processes in manufacturing              
          its PCA's.  For example, petitioner developed and used the                  
          "no-clean" process that eliminated the need to clean PCA's after            
          soldering.  Before developing the no-clean process, Compaq U.S.             
          had to clean PCA's, removing flux from the printed circuit board.           
          Flux is a detergent used prior to soldering to remove impurities            
          from the soldering surfaces and to prepare a clean surface for              
          joining.  Flux had to be removed after soldering to prevent PCA             
          corrosion and field failures.  The no-clean process uses less               
          potent flux that does not cause corrosion or field failures and             





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Last modified: May 25, 2011