- 6 -
incorporates video cameras that examine each chip's and PCA's
rotation and orientation to ensure precise placement.
Compaq U.S. used Fuji placement equipment and generally required
unrelated subcontractors to use the same equipment. In addition,
SMT manufacturing requires well-trained machine operators to
follow detailed manufacturing procedures and experienced
engineers to supervise and control the manufacturing process.
Through hole technology is less reliant on manufacturing
equipment. Accordingly, through hole components may be inserted
manually or by machines, depending upon the number of components
on the PCA. When there are very few through hole components or
odd-shaped through hole components, the through hole components
are inserted manually.
Compaq U.S. Processes
Compaq U.S. used many advanced processes in manufacturing
its PCA's. For example, petitioner developed and used the
"no-clean" process that eliminated the need to clean PCA's after
soldering. Before developing the no-clean process, Compaq U.S.
had to clean PCA's, removing flux from the printed circuit board.
Flux is a detergent used prior to soldering to remove impurities
from the soldering surfaces and to prepare a clean surface for
joining. Flux had to be removed after soldering to prevent PCA
corrosion and field failures. The no-clean process uses less
potent flux that does not cause corrosion or field failures and
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next
Last modified: May 25, 2011