Appeal No. 97-4091
Application 08/382,701
interconnecting the solid state device regions, the metal
wiring having a resistivity less than about 2.5 microhm-
centimeters;
B) an amorphous silicon carbide layer covering the metal
wiring; and
C) a second layer of metal wiring formed on the layer of
amorphous silicon carbide, wherein the second layer of metal
wiring is electrically connected to the first layer of metal
wiring.
15. A wiring board comprising:
A) a wiring board subassembly containing thereon metal
wiring having a resistivity less than about 2.5 microhm-
centimeters;
B) an amorphous silicon carbide layer covering the metal
wiring; and
C) a dielectric layer covering the silicon carbide layer.
Opinion
We do not sustain the rejection of claims 1-15 under
35 U.S.C. § 103 as being unpatentable over Yonezawa and Yamazaki.
This decision is based solely on the rationale as
articulated by the examiner. We offer no opinion on the
patentability of any claim based on other grounds.
We begin our discussion with claim interpretation. All
three independent claims specifically require that the amorphous
silicon carbide layer be "covering" the metal wiring. The word
"covering" appears in the original claims as filed and the
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