Appeal No. 1996-0060
Application No. 08/033,596
a metallic base having interior and exterior surfaces and
an array of through holes, a dielectric layer coating at least
a portion of said metallic base;
a plurality of metallic terminal pins extending through
said holes and terminating approximately at said exterior
surface, at least a portion of said metallic terminal pins
electrically isolated from said metallic base, said metallic
terminal pins adapted to receive solder on the end adjacent
said exterior surface;
a means for electrically interconnecting said metallic
terminal pins to an electronic device mounted on said metallic
base, said electrically interconnecting means selected from
the
group consisting of thick films, thin films, internal circuit
boards, wire bonds and metallic foils; and
a cover bonded to said metallic base with said electronic
device disposed therebetween.
The references relied on by the examiner are:
McShane et al. (McShane) 5,006,922 Apr.
9, 1991
Shindo 0 272 390 June 29, 1988
(European Patent Application)
Yamamoto et al. (Yamamoto) 3 4-33357 Feb. 4, 1992
(Japanese Patent Application)
Claims 1, 2 and 9 stand rejected under 35 U.S.C. § 102(b)
as being anticipated by Shindo.
3A copy of the translation for this reference is
attached.
3
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007