Ex parte MISHIO et al. - Page 2




          Appeal No. 96-3997                                                          
          Application No. 08/173,953                                                  


               The claimed invention relates to a breakdown type bipolar              
          diode incorporated in an integrated circuit.                                
               Claim 6 is illustrative of the invention and reads as                  
          follows:                                                                    
               6.  A bipolar diode comprising:                                        
               an epitaxial layer of a first conductivity type formed on              
          a semiconductor substrate of a second conductivity type;                    
               an impurity region of the first conductivity type formed               
          in a surface portion of the epitaxial layer;                                
               a first impurity region of the second conductivity type                
          formed in the surface portion of the epitaxial layer in a                   
          manner to contact with the impurity region of the first                     
          conductivity type;                                                          
               a second impurity region of the second conductivity type               
          formed in contact with the impurity region of the first                     
          conductivity type and the first impurity region; and                        
               an insulating layer formed over the surface of the                     
          epitaxial layer to protect a junction end of the associated                 
          regions;                                                                    
               wherein said second impurity region is formed in a region              
          shallower than a buried layer of the first conductivity type                
          formed between the epitaxial layer and the semiconductor                    
          substrate, the second impurity region having a maximal                      
          impurity  concentration at a predetermined distance from the                
          surface of the epitaxial layer toward an inside of the                      
          epitaxial layer and being higher in impurity concentration                  
          than the first impurity region,                                             
          and                                                                         
               wherein a breakdown of a junction of the impurity region               
          of the first conductivity type and the second impurity region               
          is caused at a location shallower than the buried layer.                    
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